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products fixed thick film chip resistors type ?l?b?q?o?r series page 1/13 products: fixed thick film chip resistors type: mcr03 series rohm co., ltd ?d resistor div ?d date: 6/apr/2005 specification no.?f?l?b?q?o?r?|?h?` design check approval rev. ?p?p?o?d tsz2211103 specification
products fixed thick film chip resistors type ?l?b?q?o?r series page 2/13 < specifications (precautions and prohibitions) > ?? safety precautions 1) the products are designed and produced for applicati on in ordinary electronic equipment (av equipment, oa equipment, telecommunication equipment, home appliances, amusement equipment, etc.). if the products are to be used in devices requiring extremely high reliability (medical equipment, transport equipment, aircraft/spacecr aft, nuclear power controllers, fuel controllers, car equipment including car accessories, safety devices, etc.) and w hose malfunction or operational error may endanger human life and sufficient fail-safe measures, please co nsult with the company?s sales staff in advance. if product malfunctions may result in serious damage, including that to human life, sufficient fail-safe measures must be taken, including the following: [a] installation of protection circuits or othe r protective devices to improve system safety [b] installation of redundant circuits in the case of single-circuit failure 2) the products are designed for use in a standard e nvironment and not in any special environments. application of the products in a special environment can deteriorate product performance. accordingly, verification and confirmation of product performance, prior to use, is recommended if used under the following conditions: [a] use in various types of liquid, including water, oils, chemicals, and organic solvents [b] use outdoors where the products are exposed to direct sunlight, or in dusty places [c] use in places where the products are exposed to sea winds or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use in places where the products are exposed to static electricity or electromagnetic waves [e] use in proximity to heat-producing components, plastic cords, or other flammable items [f] use involving sealing or coating the products with resin or other coating materials [g] use involving unclean solder or use of water or water-soluble cleaning agents for cleaning after soldering [h] use of the products in places subject to dew condensation 3) the products are not radiation resistant. 4) the company is not responsible for any problems re sulting from use of the products under conditions not recommended herein. 5) the company should be notified of any product safety issues. moreover, product safety issues should be periodically monitored by the customer. ?? precautions regarding applicatio n examples and external circuits 1) if change is made to the constant of an external circuit, allow a sufficient margin due to variations of the characteristics of the products and external components, including transient characteristics, as well as static characteristics. 2) the application examples, their constants, and other types of information contained herein are applicable only when the products are used in accordance with standard methods. therefore, if mass production is intended, sufficient consideration to external conditions must be made. rev.?f ?p?p?o?d specification no.?f?l?b?q?o?r?|?h?` tsz2211104
products fixed thick film chip resistors type ?l?b?q?o?r series page 3/13 < specifications (precautions and prohibitions) > ?? precautions regarding foreign exch ange and foreign trade control law 1) the company has not determined whether or not th e products are considered ?a controlled product or labor ? as specified in the foreign exchange and foreign trade control law. accordingly, if exportation of the products, either separately or integrated in another company?s products, is intended, or giving the products to persons who are not residents is planed, additional steps are required, based upon the appropriate regulations. ?? prohibitions regarding industrial property 1) these specifications contain information related to the company?s industrial property. any use of them other than pertaining to the usage of appropriate products is not permitted. duplication of these specifications and its disclosure to a third party without the company?s permission is prohibited. 2) information and data on products, including applicati on examples, contained in these specifications are simply for reference; the company does not guarantee any industrial property rights, intellectual property rights, or any other rights of a third party regarding this information or data. accordingly, the company does not bear any responsibility for: [a] infringement of the intellectual property rights of a third party [b] any problems incurred by the use of the products listed herein. 3) the company prohibits the purchaser of its products to exercise or us e the intellectual property rights, industrial property rights, or any other rights that either belong to or are controlled by the company, other than the right to use, sell, or dispose of the products. ?? precautions on use of products 1) verification and confirmation of performance charact eristics of products, after on-board mounting, is advised. 2) in particular, if a transient load (a large amount of load applied in a short period of time, such as pulse) is applied, confirmation of performance characteristics after on-board mounting is strongly recommended. avoid applying power exceeding normal rated power ; exceeding the power rating under steady-state loading condition may negatively affect product performance and reliability. 3) when a highly active halogenous (chlorine, bromin e, etc.) flux is used, the remainder of flux may negatively affect product performance and reliability. 4) in principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the company in advance 5) pay attention to the soldering condition in order to avoid problems due to silver absorption into solder. 6) be careful when pick up the products with tweezers. there may be a case that the overcoat and /or the body can be chipped. 7) soldering tip shall not touch the product when install product manually. 8) product may be damaged when the impact, such as downfall is given. ?? precautions regarding product storage 1) product performance and soldered connections may dete riorate if the products are stored in the following places: [a] where the products are exposed to s ea winds or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [b] where the temperature or humidity exceeds those recommended by the company 2) the guaranteed period of solder connections and product performance is within one year from shipment by the company, provided that the above-mentioned storage conditions have been satisfied. ?? other matters 1) please sign these specifications and return one copy to the company. if a copy is not returned within three months after th e issued date specified on the front page of these specifications, the company will consider the specifications accepted. 2) if any matter related to these specifications needs to be clarified, discussions shall be held promptly between the two parties concerned to determine the issue. rev.?f ?p?p?o?d specification no.?f?l?b?q?o?r?|?h?` tsz2211104
products fixed thick film chip resistors type ?l?b?q?o?r series page 4/13 1.scope this specification covers the characteristics of ?g mcr03 series (including jumper type) ?h based of thick film chip resistors in rohm co., ltd. products. 2.classification mcr03 ezh j, f * ???????i???j * type packaging code tolerance resistance *jumper is ?u j 000 ?v value (iec code) tolerance packaging code package quantity f( ?} 1 %) j( ?} 5%) ezh 180mm(7inch) reel, paper tape (4mm pitch) 5,000pcs/reel f j resistance value 4digits f 3digits j 3.rating items conditions specifications for resistors operated at the ambient temperature in excess of 70 ?? , the load shall be derated in accordance with fig.1 fig.1 rated power (%) -55 0 70 155 ambient temperature ( ?? ) 0.10w(1/10w) at 70 ?? rated voltage is determined from the following. when rated voltage exceeds the limiting element voltage, the limiting element voltage shall be the rated voltage. e = pr e: rated voltage (v) rated voltage p: rated power (w) r: resistance ( ?? ) limiting element voltage 50v resistance see table.1 temperature - 55 ?? ?` +155 ?? jumper type resistance max.50m ?? rated current 1a temperature range -55 ?? ?` +155 ?? table.1 tolerance resistance range ( ?? ) temperature (ppm/ ?? ) coefficient f( ?} 1%) 10 ?? r ?? 2.2m (e24,e96) 200 1.0 ?? r ?? 2.2 (e24) 500350 2.2 ?? r ?? 10 (e24) 500 j( ?} 5%) 10 ?? r ?? 10m (e24) 200 rev. ?f ?p?p?o?d specification no. ?f?l?b?q?o?r?|?h?` tsz2211104 100 80 60 40 20 0
products fixed thick film chip resistors type ?l?b?q?o?r series page 5/13 4.characteristics guaranteed value items resistor type jumper type test conditions (jis c 5201-1) 4.1 resistance f:1% j:5% max. ?t?o???? jis c 5201-1 4.5 4.2 variation of resistance with temperature see table.1 jis c 5201-1 4.8 measurement ?f -55/+25/+125 ?? mounting condition: see fig.3 4.3 overload ?} (2.0 ???{ 0.1 ?? ) max. ?t?o???? jis c 5201-1 4.13 rated voltage(current) ?~ 2.5 ?c 2s limiting element voltage ?~ 2 ?f 100 ?u mounting condition: see fig.3 4.4 solderability a new uniform coating of minimum of 95% of the surface being immersed and no soldering damage. jis c 5201-1 4.17 rosin ethanol(25%wt) soldering condition ?f 235 ?} 5 ?? duration of immersion ?f 2.0 ?} 0.5s. ?} (1.0 ???{ 0.05 ?? ) max. ?t?o???? 4.5 resistance to soldering heat no remarkable abnormality on the appearance. jis c 5201-1 4.18 soldering condition ?f 260 ?} 5 ?? duration of immersion ?f 10 ?} 1s. 4.6 rapid change of temperature ?} (1.0 ???{ 0.05 ?? ) max. ?t?o???? jis c 5201-1 4.19 test temp. ?f -55 ???` +125 ?? 5cyc mounting condition: see fig.3 4.7 damp heat, steady state ?} (3.0 ???{ 0.1 ?? ) max. ?p?o?o???? jis c 5201-1 4.24 40 ???c 93 ?? rh test time ?f 1,000h ?` 1,048h mounting condition: see fig.3 4.8 endurance at 70 ?? ?} (3.0 ???{ 0.1 ?? ) max. ?p?o?o???? jis c 5201-1 4.25.1 rated voltage(current),70 ?? 1.5h:on ?| 0.5h:off test time ?f 1,000h ?` 1,048h mounting condition: see fig.3 4.9 endurance ?} (3.0 ???{ 0.1 ?? ) max. ?p?o?o???? jis c 5201 -1 4.25.3 155 ?? test time ?f 1,000h ?` 1,048h mounting condition: see fig.3 4.10 resistance to solvent ?} (1.0 ???{ 0.05 ?? ) max. ?t?o???? jis c 5201-1 4.29 23 ?}?t?? , immersion cleaning, 5 ?} 0.5min solvent: 2-propanol ?} (1.0 ???{ 0.05 ?? ) max. ?t?o???? 4.11 bend strength of the end face plating without mechanical damage such as breaks. jis c 5201-1 4.33 mounting condition: see fig.4 * in the items on characteristics, the expression " ?} (1.0% + 0.05 ?? )" is used in the column for standard values. however, this is because of dramatic increase in the fluctuation ratio that can be take place in the low resistance value range and is not meant to supplement the measuring accuracy of the measuring instruments. accordingly, there is a need to increase the de sign tolerance in the low resistance value range. rev.?f ?p?p?o?d specification no.?f?l?b?q?o?r?|?h?` tsz2211104
products fixed thick film chip resistors type ?l?b?q?o?r series page 6/13 ?t?d dimensions & construction fig.2 (unit: mm) 0.45 ?}0.1 1.6 0.3 ?}0.2 0.8?}0.1 ?@ ?a ?b ?c ?d ?e 0.3 ?}0.2 ?}0.1 ?? material ?@ resistive element ?a silver thick film electrode ?b nickel electrode ?c sn electrode ?d alumina substrate ?e over coating rev.?f ?p?p?o?d specification no.?f ?l?b?q?o?r?|?h?` tsz2211104
products fixed thick film chip resistors type ?l?b?q?o?r series page 7/13 ?u?d markings ?u?d?p markings on chip resistor the description of markings on the chip resistor are as shown below. blue glass over coat is used for marking on the jumper type. * on jumper types, there ma y be some products with one part of the markings missing. ?@ marking method : there are three digits used for the calculation number according to iec code and ?g r ?h is used for the decimal point. example ?f 100k ?? =104 2.2 ?? =2r2 ?a marking direction : standard, resistor surface marking. ?b marking colors : yellowish white marking or other appropriate marking ?u?d?q marking on the packaging container the following items will be displayed on the smallest unit of the container used for packaging. japan excellence ???? ?d???????????????????? rohm f?@5,000pcs 0005 09001f ?x?d?s?`?m?`?j?` ?j?d?r?`?s?n ?l?d?r?t?y?t?j?h mcr03 ?d?y?g j 102 ?@ 0123456789abcdefghi j0123456789abcdefghi j ?a ?b ?c ?d ?e japan excellence ???? ?d???????????????????? rohm f?@5,000pcs 0005 09001f ?x?d?s?`?m?`?j?` ?j?d?r?`?s?n ?l?d?r?t?y?t?j?h mcr03 ?d?y?g j 102 ?@ 0123456789abcdefghi j0123456789abcdefghi j ?a ?b ?c ?d ?e ?@ type + packaging code + tolerance + resistance value ?a bar code of type code + resistance value ?b special code + quantity + lot no. (there may be label with and without special code.) ?c bar code of quantity + lot no. ?d part no. ?{ order no. (to be executed on necessity) ?e qr code (there may be labels with and without qr code.) ?v?d appearance quality an appearance inspection of the surface should reveal no obvious abnormalities. ?@ there should be no obvious abnormalities such as bubbles, pin holes or cracks on the overcoat or outer termination. ?a there should be no obvious electrode material or other foreign matter on the overcoat. ?b there should be no obvious electrode material or other foreign matter on back surface of the substrate and on side surface of the longitudinal axis. ?w?d mass the mass of the chip resistor is 2.0mg ?} 0.5mg. ?x?d deciphering the manufacturing date from the lot no. an example of the lot no. is shown below. read the manufacturing date and take first-in first-out method. example ?f 00 05 ?@ ?a ?b ?@ manufacturing year : last two digits of the western calendar year. (2000) ?a week of manufacture : shows week 01 to 53 in a year. (05:1/23 to 1/29) ?b shows line number, serial number or manufacturing plant code. rev.?f ?p?p?o?d specification no.?f ?l?b?q?o?r?|?h?` tsz2211104
products fixed thick film chip resistors type ?l?b?q?o?r series page 8/13 ?p?o?d recommendable condition of soldering ?p?o?d?p reflow soldering (1) reflow soldering with lead solder. (2) reflow soldering with lead free solder. condition of soldering : preheat 150 ?? less than 1min. condition of soldering : preheat 150 ?? less than 1min. maximum temperature : 240 ?} 5 ?? less than 6s. maximum temperature : 260 ?} 5 ?? less than 10s. time : maximum of twice. time : maximum of twice. 50 100 150 200 240 300 soldering temperature( ?? ) 2 1 34 max.2.5min. max .6 s . 3?`4min. (min) 50 100 150 200 260 300 soldering temperature( ?? ) 2 1 34 max.2.5min. 3?`4min. max .10 s . (min) ?p?o?d?q reworking of soldering reworking of soldering shall be limited to one time. ?@ temperature of soldering tip : 350 ?? or less. ?a working time : not longer than 3s. ?b soldering iron : 20w or less. ?p?p?d others ?p?p?d?p in regard to the export trade control decree. resistor that rohm co., ltd ?d sells is not an object of controlled goods in annex 1(item 1 ?` 15) of export trade control order. but it is an object of controlled goods in annex 1(item 16) of export trade control order. in case of export, please c onfirm if it applies to "objective" criteria or an "informed"(by mitt clause) on the basis of "catch-all" controls for non-proliferation of weapons of mass destruction. ?p?p?d?q on use of ozone layer destroying substances no ozone layer destroying substances are used in our resistors. ?p?p?d?r on use of fluorocarbons no specific fluorocarbons or alternative fluor ocarbons are used in the manufacture of our resistors. ?p?p?d?s regarding specific bromine type fire resistant materials none of the following specific bromine type materials are used in our resistors. ?@ ?o?a?a?o?? ?a ?o?a?a?? ?p?p?d?t requests prior to changes in the manufacture and utilization of the chip resistors there are conditions that develop which require materials or processes to be changed. in such cases, request will be made prior to clang to obtain approval. ?p?p?d?u manufacturing flow chart and basic design quality as requested specially, the flow chart for the manufacturing processes of the chip resistor and the basic quality will be submitted separately. rev.?f ?p?p?o?d specification no.?f ?l?b?q?o?r?|?h?` tsz2211104
products fixed thick film chip resistors type ?l?b?q?o?r series page 9/13 fig.3 ?f test board a (unit: mm) ?q?n?g?l ?l?b?q?o?r 2.0 2.54 1.32 58.5 2.2 4.0 2.0 5.0 32.0 1.0 8.5 11.5 note) *1 the shaded area shows the solder resist treatment. *2 the terminals used for connectors are plated with rhodium. *3 all surface, except terminals used fo r connectors, receive pre-flux treatment. fig.4 ?f test board b 3 tester r340 pressurization solder specimen 10 20 3.0 40 100 1.2 1.0 2.0 note) *1 the shaded area shows the solder resist treatment. *2 all surface, except terminals used for connectors, receive pre-flux treatment. *3 during the test, the distance among support points shall be 90mm and the center of the chip resistor and the center between support points should be aligned to within ?} 2mm. laminate material: glass fabric base epoxies. compatible with jis c 6484 thickness of board ?f 1.6mmt copper material: copper purity is 99.5% or more. compatible with jis c 6484 copper foil thickness ?f 35 ??? rev.?f ?p?p?o?d specification no.?f ?l?b?q?o?r?|?h?` tsz2211104
products fixed thick film chip resistors type ?l?b?q?o?r series page 10/13 1. scope this specification covers the tape package re quirements for chip resistor mcr03, to be used on automatic placement systems. 2. packaging code mcr03 ezh j, f ???????i???j type packaging resistance resistance code tolerance value (iec code) 3. tape dimension (unit: mm) base paper top tape (bottom tape) components cavity t2 w a0 b0 f e ? d0 p1 p0 p2 w f e a0 b0 8.0 ?} 0.3 3.5 ?} 0.05 1.75 ?} 0.1 1.1 ?} 0.1 1.9 ?} 0.1 d0 p0 p1 p2 t2 +0.1 ? 1.5 0 4.0 ?} 0.1 4.0 ?} 0.1 2.0 ?} 0.05 max.1.1 rev.?f ?p?p?o?d specification no.?f ?l?b?q?o?r?|?h?` tsz2211104
products fixed thick film chip resistors type ?l?b?q?o?r series page 11/13 4. mechanical characteristics 4.1 cover tape peeling strength : 0.1n ?? peeling strength ?? 0.6n bottom tape feeding direction top tape peel back direction base paper 4.2 base tape should not adhere to top tape when top tape is peeled back, and peel back direction is as follows. base paper about ?p?v?o?k peel back direction top tape bottom tape feeding direction 4.3 durability of cover tape (top tape) top tape shall not be off the base paper after 120hrs at the atmosphere of 60 ?} 3 ?? ,90 ?` 95%r.h. 5. tape packaging 5.1 components are set in tape cavities with the same side (resistive paste upside). 5.2 the accumulated pitch tolerance shall be within ?} 0.2mm at 10 pitches. 5.3 tape bent resistance no damage on the tape and the cavity when tape is bent with the radius of 15mm. 5.4 components in tape cavity shall not adhere to bottom / cover tape. 5.5 components shall not be blocked by tape fragments or foreign materials when they are taken out from cavities. 5.6 the top tape shall not cover up the sprocket holes of tape. 5.7 the number of missing components shall not exceed 0.1% of the total number of components (marked number) or one whichever is the larger, and no consecutive missing exceeding two is allowed. rev.?f ?p?p?o?d specification no.?f ?l?b?q?o?r?|?h?` tsz2211104
products fixed thick film chip resistors type ?l?b?q?o?r series page 12/13 6. tape reel 6.1 tape feeding direction shall be shown in the picture drawn below. 0.2 0.4 0.6 0.8 0.2 0.4 0.6 0.8 feeding direction label feeding direction sprocket hole component label 6.2 leader tape leader tape is given a portion of only cover tape and of blank cavities. (no resistor.) 320 ?} 50 mm 230 ?} 50 mm (note) the leader portion of cove r tape will not stick to embossed tape. (about 5 ?` 10mm) 6.3 tail tape(trail tape) trail tape is given a portion of blank cavities (no resistor). and the trail tape should not be fixed by adhesive to real and must be the one which can be pulled out easily from the reel. 40 mm or more rev.?f ?p?p?o?d specification no.?f ?l?b?q?o?r?|?h?` tsz2211104
products fixed thick film chip resistors type ?l?b?q?o?r series page 13/13 7. reel dimensions (unit: mm) 0.2 0.4 0.6 0.8 0.2 0.4 0.6 0.8 label d b a c according to eiaj et-7200b a b c d 0 ? 180 -1.5 +1 ? 60 0 +1.0 9 0 ? 13 ?} 0.2 material reel: polystyrene packing 5,000pcs / reel rev.?f ?p?p?o?d specification no.?f ?l?b?q?o?r?|?h?` tsz2211104

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